Invention Grant
- Patent Title: Low penetration low formaldehyde alkyd composition
- Patent Title (中): 低渗透低甲醛醇酸组合物
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Application No.: US13139997Application Date: 2009-12-18
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Publication No.: US08337995B2Publication Date: 2012-12-25
- Inventor: Shaobing Wu , Thomas J. Melnyk , William E. Hale
- Applicant: Shaobing Wu , Thomas J. Melnyk , William E. Hale
- Applicant Address: US MN Minneapolis
- Assignee: Valspar Sourcing, Inc.
- Current Assignee: Valspar Sourcing, Inc.
- Current Assignee Address: US MN Minneapolis
- Agency: IPLM Group, P.A.
- International Application: PCT/US2009/068807 WO 20091218
- International Announcement: WO2010/071829 WO 20100624
- Main IPC: B32B23/04
- IPC: B32B23/04

Abstract:
Soak-in and strike through on the exposed end grain portions of low density or porous wood substrates including alder, birch, pine, poplar, and soft maple are reduced by applying to the end grain a solvent-borne coating composition containing an (i) alkyd resin having a hydroxyl number less than about 150, (ii) acid catalyst and (iii) cross linker. The resin desirably has a number average molecular weight greater than about 2000, and may have a Gardner coloration less than about 3 or may be a short oil alkyd based on coconut oil. By using a reduced hydroxyl number alkyd resin, a reduced cross linker amount may be employed, thereby reducing formaldehyde evolution in compositions made with methylated amino resin cross linkers such as methylated melamine resins.
Public/Granted literature
- US20110262759A1 LOW PENETRATION LOW FORMALDEHYDE ALKYD COMPOSITION Public/Granted day:2011-10-27
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