发明授权
- 专利标题： LED package and method for manufacturing the same
- 专利标题（中）： LED封装及其制造方法
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申请号： US12868107申请日： 2010-08-25
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公开(公告)号： US08338845B2公开(公告)日： 2012-12-25
- 发明人: Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
- 申请人： Gen Watari , Satoshi Shimizu , Hiroaki Oshio , Tatsuo Tonedachi , Kazuhisa Iwashita , Tetsuro Komatsu , Teruo Takeuchi
- 申请人地址： JP Tokyo
- 专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人： Kabushiki Kaisha Toshiba
- 当前专利权人地址： JP Tokyo
- 代理机构： Turocy & Watson, LLP
- 优先权： JP2010-019769 20100129
- 主分类号： H01L33/00
- IPC分类号： H01L33/00 ; H01L27/15 ; H01L31/12 ; H01L29/04 ; H01L31/036
摘要：
According to one embodiment, an LED package includes first and second lead frames, an LED chip and a resin body. The first and second lead frames are made of a metal material, and disposed to be apart from each other. The LED chip is provided above the first and second lead frames, the LED chip having one terminal connected to the first lead frame and another terminal connected to the second lead frame. The resin body is made of a resin material having a shore D hardness of 25 or higher. In addition, the resin body covers the first and second lead frames and the LED chip. And, an appearance of the resin body is an appearance of the LED package.
公开/授权文献
- US20110186886A1 LED PACKAGE AND METHOD FOR MANUFACTURING THE SAME 公开/授权日：2011-08-04
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