Invention Grant
- Patent Title: Electronic device with a motherboard waterproofing mechanism
- Patent Title (中): 具有主板防水机构的电子设备
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Application No.: US12578698Application Date: 2009-10-14
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Publication No.: US08339793B2Publication Date: 2012-12-25
- Inventor: Yu-Han Tsai , Chun-Wang Lin , Yu-Hsien Huang , Chi-Jen Lo , Feng-Hsiung Wu
- Applicant: Yu-Han Tsai , Chun-Wang Lin , Yu-Hsien Huang , Chi-Jen Lo , Feng-Hsiung Wu
- Applicant Address: TW
- Assignee: Wistron Corporation
- Current Assignee: Wistron Corporation
- Current Assignee Address: TW
- Agency: Ostrolenk Faber LLP
- Priority: TW98211357U 20090624
- Main IPC: H05K5/00
- IPC: H05K5/00 ; H05K7/00 ; H05K7/14

Abstract:
An electronic device includes: first and second housing bodies cooperating to form an inner receiving space; a motherboard disposed in the inner receiving space, partitioned by a partition line into a port zone having at least one input/output connector, and a non-port zone; first and second waterproof strips disposed respectively between the first housing body and the motherboard and between the second housing body and the motherboard, and disposed at the partition line, the second waterproof strip having opposite ends formed with respective extension parts extending perpendicularly toward the first waterproof strip and disposed at the peripheral edge of the motherboard; and a third waterproof strip connected to the first waterproof strip to form a closed seal ring therewith, disposed between the first and second housing bodies, and disposed at an outer side of a peripheral edge of the non-port zone.
Public/Granted literature
- US20100328906A1 ELECTRONIC DEVICE WITH A MOTHERBOARD WATERPROOFING MECHANISM Public/Granted day:2010-12-30
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