Invention Grant
- Patent Title: Method of managing process factors that influence electrical properties of printed circuit boards
- Patent Title (中): 管理影响印刷电路板电气特性的工艺因素的方法
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Application No.: US13092966Application Date: 2011-04-24
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Publication No.: US08341587B2Publication Date: 2012-12-25
- Inventor: Hsiao-Yun Su , Ying-Tso Lai , Cheng-Hsien Lee
- Applicant: Hsiao-Yun Su , Ying-Tso Lai , Cheng-Hsien Lee
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99130514A 20100909
- Main IPC: G06F17/50
- IPC: G06F17/50

Abstract:
In a method of managing process factors that influence electrical properties of printed circuit boards (PCBs), n process factors are arranged in an order according to different influence to one kind of electrical property of the PCBs. The different influence is determined by first experiments designed using the Taguchi method. M process factors that have important influence to the electrical property are obtained from the n process factors according to the order to design second experiments. A computing formula for the electrical property is fitted using the m process factors according to simulated results of the second experiments, and a variation range of each of the m process factors is computed according to the computing formula.
Public/Granted literature
- US20120066660A1 METHOD OF MANAGING PROCESS FACTORS THAT INFLUENCE ELECTRICAL PROPERTIES OF PRINTED CIRCUIT BOARDS Public/Granted day:2012-03-15
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