发明授权
- 专利标题： Forming apparatus and forming method
- 专利标题（中）： 成型装置及成型方法
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申请号： US12765151申请日： 2010-04-22
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公开(公告)号： US08341998B2公开(公告)日： 2013-01-01
- 发明人: Taku Saito , Naoki Watanabe
- 申请人： Taku Saito , Naoki Watanabe
- 申请人地址： JP Tokyo
- 专利权人： Konica Minolta Business Technologies, Inc.
- 当前专利权人： Konica Minolta Business Technologies, Inc.
- 当前专利权人地址： JP Tokyo
- 代理机构： Holtz, Holtz, Goodman & Chick, PC
- 优先权： JP2009-110697 20090430
- 主分类号： B21D53/04
- IPC分类号： B21D53/04
摘要：
A forming apparatus to bend a plate-shaped material, including: a first forming device to bend one surface of the plate-shaped material not more than 180 degrees by pressing the plate-shaped material; a second forming device to bend another surface of the plate-shaped material not more than 180 degrees by pressing the plate-shaped material; wherein the first and the second forming device perform bending while changing a relative position by interlocking with each other.
公开/授权文献
- US20100275671A1 FORMING APPARATUS AND FORMING METHOD 公开/授权日：2010-11-04
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