Invention Grant
- Patent Title: Pipe coupling member for high-pressure fluid
- Patent Title (中): 高压流体用管接头
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Application No.: US12532565Application Date: 2008-03-19
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Publication No.: US08342202B2Publication Date: 2013-01-01
- Inventor: Takuya Nishio , Kunihiko Goto , Kazunori Aoki , Osamu Yamamoto , Kazuyoshi Tashiro , Goro Suzuki , Shinichi Nomura , Kosei Yoshida
- Applicant: Takuya Nishio , Kunihiko Goto , Kazunori Aoki , Osamu Yamamoto , Kazuyoshi Tashiro , Goro Suzuki , Shinichi Nomura , Kosei Yoshida
- Applicant Address: JP Tokyo JP Aichi-ken
- Assignee: Nitto Kohki Co., Ltd.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee: Nitto Kohki Co., Ltd.,Toyota Jidosha Kabushiki Kaisha
- Current Assignee Address: JP Tokyo JP Aichi-ken
- Agency: Wenderoth, Lind & Ponack, L.L.P.
- Priority: JP2007-075506 20070322
- International Application: PCT/JP2008/055074 WO 20080319
- International Announcement: WO2008/114816 WO 20080925
- Main IPC: F16K1/42
- IPC: F16K1/42

Abstract:
A pipe coupling member for high-pressure fluid such as liquefied hydrogen includes a seal ring having a highly effective sealing function to prevent leakage of the fluid. The seal ring (72) is set in a seal ring setting space (39) defined by a second radial surface (36) and a seal ring setting surface (38) of a first tubular member (20), a forward end surface of a second tubular member (22), and the outer peripheral surface of a valve seat member (24). A forward end portion of the second tubular member (22) is provided with a communication hole (84) radially penetrating the forward end portion. The pressure of the high-pressure fluid on the downstream side of a valve seat surface (52) causes a fluid path in the second tubular member to be communicated with the sealing ring setting space (39) via the communication hole (84) and via a gap between the seal ring setting surface (38) and the outer peripheral surface of the forward end portion of the second tubular member.
Public/Granted literature
- US20100108162A1 PIPE COUPLING MEMBER FOR HIGH-PRESSURE FLUID Public/Granted day:2010-05-06
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