发明授权
- 专利标题: Conductive paste composition and method for producing multilayer ceramic capacitor using the same
- 专利标题(中): 导电糊组合物及其制造方法
-
申请号: US13026685申请日: 2011-02-14
-
公开(公告)号: US08343385B2公开(公告)日: 2013-01-01
- 发明人: Jong Han Kim , Hyun Chul Jeong , Sung Bum Sohn , Jai Joon Lee
- 申请人: Jong Han Kim , Hyun Chul Jeong , Sung Bum Sohn , Jai Joon Lee
- 申请人地址: KR Gyunggi-do
- 专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人: Samsung Electro-Mechanics Co., Ltd.
- 当前专利权人地址: KR Gyunggi-do
- 代理机构: McDermott Will & Emery LLP
- 优先权: KR10-2010-0110366 20101108
- 主分类号: H01B1/22
- IPC分类号: H01B1/22
摘要:
Disclosed herein is a conductive paste composition. The conductive paste composition according to the exemplary embodiment of the present invention includes a conductive powder including nickel or a nickel alloy; a spherical particulate inhibitor including BaTiO3 powders; and a glass composition having Chemical Formula of aLi2O-bK2O-cCaO-dBaO-eB2O3-fSiO2, wherein a, b, c, d, e, and f satisfy a+b+c+d+e+f=100, 2≦a≦10, 2≦b≦10, 0≦c≦25, 0≦d≦25, 5≦e≦20, and 50≦f≦80.
公开/授权文献
信息查询