发明授权
- 专利标题: Method of fabricating thin film transistor by crystallization through metal layer forming source and drain electrodes
- 专利标题(中): 通过金属层形成源极和漏极结晶化制造薄膜晶体管的方法
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申请号: US13206227申请日: 2011-08-09
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公开(公告)号: US08343796B2公开(公告)日: 2013-01-01
- 发明人: Ji-Su Ahn , Sung-Chul Kim
- 申请人: Ji-Su Ahn , Sung-Chul Kim
- 申请人地址: KR Yongin, Gyeonggi-do
- 专利权人: Samsung Display Co., Ltd.
- 当前专利权人: Samsung Display Co., Ltd.
- 当前专利权人地址: KR Yongin, Gyeonggi-do
- 代理机构: Lee & Morse, P.C.
- 优先权: KR10-2008-0064001 20080702
- 主分类号: H01L21/00
- IPC分类号: H01L21/00
摘要:
A method of fabricating a thin film transistor includes patterning the amorphous semiconductor layer to form an amorphous semiconductor layer pattern, forming a gate electrode corresponding to the amorphous semiconductor layer pattern on a gate insulating layer, forming an interlayer insulating layer on the entire surface of the substrate, forming a first contact hole partially exposing the amorphous semiconductor layer pattern, forming a second contact hole partially exposing the gate electrode, and forming a metal layer on the entire surface of the substrate. The method also includes applying an electrical field to the metal layer such that a semiconductor layer is formed by crystallization of the amorphous semiconductor layer pattern, and patterning the metal layer to form source and drain electrodes that are insulated from the gate electrode and that are electrically connected with the semiconductor layer through the first contact hole.
公开/授权文献
- US20110294267A1 METHOD OF FABRICATING THIN FILM TRANSISTOR 公开/授权日:2011-12-01
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