There is provided a thermoplastic resin composition which comprises a modified rubber having excellent low-temperature durability dispersed in a polyamide resin matrix in order to improve the low-temperature durability or repeated fatigue resistance of the polyamide resin and which maintains its flowability and can be formed into a film even at a high content of the modified rubber, and has excellent low-temperature durability. The thermoplastic resin composition comprises a modified polyamide resin (A) obtained by melt blending 100 parts by weight of a polyamide resin (A1) and 0.05 to 5 parts by weight of a compound (A2) capable of binding to a terminal amino group of the polyamide resin, at a temperature equal to or higher than the melting point of the polyamide resin (A1), and a modified rubber (B) having an acid anhydride group, an epoxy group, or a carboxyl group or a derivative thereof. The compound (A2) is preferably a monofunctional epoxy compound. The film of the thermoplastic resin composition is suitably used for the manufacture of tires and hoses.