Invention Grant
- Patent Title: Module having at least two surfaces and at least one thermally conductive layer therebetween
- Patent Title (中): 模块具有至少两个表面和其间的至少一个导热层
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Application No.: US12939915Application Date: 2010-11-04
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Publication No.: US08345427B2Publication Date: 2013-01-01
- Inventor: Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
- Applicant: Robert S. Pauley , Jayesh R. Bhakta , William M. Gervasi , Chi She Chen , Jose Delvalle
- Applicant Address: US CA Irvine
- Assignee: Netlist, Inc.
- Current Assignee: Netlist, Inc.
- Current Assignee Address: US CA Irvine
- Main IPC: H05K7/20
- IPC: H05K7/20
Abstract:
A module is electrically connectable to a computer system. The module includes a first surface and a first plurality of circuit packages coupled to the first surface. The module further includes a second surface and a second plurality of circuit packages coupled to the second surface. The second surface faces the first surface. The module further includes at least one thermal conduit positioned between the first surface and the second surface. The at least one thermal conduit is in thermal communication with the first plurality of circuit packages and the second plurality of circuit packages.
Public/Granted literature
- US20110110047A1 MODULE HAVING AT LEAST TWO SURFACES AND AT LEAST ONE THERMALLY CONDUCTIVE LAYER THEREBETWEEN Public/Granted day:2011-05-12
Information query
