发明授权
- 专利标题: Connection structure and connection method of wiring board
- 专利标题(中): 接线板的连接结构和连接方法
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申请号: US13073666申请日: 2011-03-28
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公开(公告)号: US08345437B2公开(公告)日: 2013-01-01
- 发明人: Tomoyuki Kubo , Yuji Shinkai
- 申请人: Tomoyuki Kubo , Yuji Shinkai
- 申请人地址: JP Aichi-ken
- 专利权人: Brother Kogyo Kabushiki Kaisha
- 当前专利权人: Brother Kogyo Kabushiki Kaisha
- 当前专利权人地址: JP Aichi-ken
- 代理机构: Scully, Scott, Murphy & Presser, PC
- 优先权: JP2010-210420 20100921
- 主分类号: H05K7/00
- IPC分类号: H05K7/00
摘要:
A connection structure for connecting a wiring board to a to-be-connected body having electric contacts, the wiring board including: a base having board-side contacts provided on its facing surface that is to face the to-be-connected body; and a cover film which covers the facing surface except the board-side contacts and a non-covered partial region of the facing surface, the connection structure including: conduction portions formed of electrically conductive resin, for bonding the electric contacts and the board-side contacts to permit electrical conduction therebetween; and a reinforcement portion formed of the same resin as the conduction portions and disposed at a position which is different from positions of the conductive portions and at which the reinforcement portion extends across both of a surface of the cover film and a surface of the non-covered partial region of the base, the reinforcement portion bonding the to-be-connected body and the wiring board for reinforcing connection therebetween.
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