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发明授权
US08345438B2 Electronic part module and method of making the same 有权
电子零件模块及其制作方法

Electronic part module and method of making the same
摘要：
An electronic part module includes a wiring substrate, a passive device group of passive devices formed on the wiring substrate, and device chips mounted on the wiring substrate. Such an electronic part module is made in the following manner. First, a wiring substrate wafer is made, to include a plurality of electronic part module formation areas. Then, a plurality of passive devices are formed in each of the electronic part module formation areas on the wiring substrate wafer. Then, the device chips are formed on each of the electronic part module formation areas on the wiring substrate wafer. Finally, the wiring substrate wafer is divided.
摘要（中）：

电子部件模块包括布线基板，形成在布线基板上的无源器件的无源器件组以及安装在布线基板上的器件芯片。 这样的电子部件模块以如下方式制成。 首先，制造布线基板晶片，以包括多个电子部件模块形成区域。 然后，在布线基板晶片上的每个电子部件模块形成区域中形成多个无源器件。 然后，在布线基板晶片上的每个电子部件模块形成区域上形成器件芯片。 最后，分配布线基板晶片。

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