Invention Grant
- Patent Title: Method and system for providing a suspension head bond pad design
- Patent Title (中): 提供悬挂头接合垫设计的方法和系统
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Application No.: US12976826Application Date: 2010-12-22
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Publication No.: US08345519B1Publication Date: 2013-01-01
- Inventor: Tzong-Shii Pan
- Applicant: Tzong-Shii Pan
- Applicant Address: US CA Fremont
- Assignee: Western Digital (Fremont), LLC
- Current Assignee: Western Digital (Fremont), LLC
- Current Assignee Address: US CA Fremont
- Main IPC: G11B11/00
- IPC: G11B11/00

Abstract:
A method and system for providing a head gimbal assembly (HGA) for an energy assisted magnetic recording (EAMR) disk drive including media is described. The HGA includes a slider, a laser assembly, and a flexure. The slider has a front side, a back side, and at least one EAMR transducer residing in proximity to the front side. The front side corresponds to an air-bearing surface (ABS) that resides in proximity to the media during use. The laser assembly includes a laser for providing energy to the EAMR transducer and is mounted on the back side of the slider. The flexure has at least one laser lead and a through-hole therein. The through-hole is configured to accommodate the laser assembly. A portion of the at least one laser lead extends over the through-hole and electrically connects the at least one laser lead with the laser.
Information query
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