Invention Grant
US08347494B2 Electronic component mounting method 失效
电子元件安装方法

Electronic component mounting method
Abstract:
A mounting method for mounting an electronic component on a printed circuit board, the mounting method includes fixing a lower surface of a magnet panel to a magnetic body included in the electronic component by a magnetic force, seizing the electronic component by attracting a part of an upper surface of the magnet panel to an attaching unit, determining a position of the attracting unit to place the electronic component at a predetermined position with respect to the printed circuit board and releasing the attracting unit from the upper surface of the magnet panel.
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