Invention Grant
- Patent Title: Electronic component mounting method
- Patent Title (中): 电子元件安装方法
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Application No.: US12570092Application Date: 2009-09-30
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Publication No.: US08347494B2Publication Date: 2013-01-08
- Inventor: Yusaku Fujiishi , Hiroshi Shimamori
- Applicant: Yusaku Fujiishi , Hiroshi Shimamori
- Applicant Address: JP Kawasaki
- Assignee: Fujitsu Limited
- Current Assignee: Fujitsu Limited
- Current Assignee Address: JP Kawasaki
- Agency: Staas & Halsey LLP
- Priority: JP2008-256919 20081002
- Main IPC: H05K3/34
- IPC: H05K3/34

Abstract:
A mounting method for mounting an electronic component on a printed circuit board, the mounting method includes fixing a lower surface of a magnet panel to a magnetic body included in the electronic component by a magnetic force, seizing the electronic component by attracting a part of an upper surface of the magnet panel to an attaching unit, determining a position of the attracting unit to place the electronic component at a predetermined position with respect to the printed circuit board and releasing the attracting unit from the upper surface of the magnet panel.
Public/Granted literature
- US20100084164A1 ELECTRONIC COMPONENT MOUNTING METHOD Public/Granted day:2010-04-08
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