Invention Grant
- Patent Title: Flow rate measuring apparatus
- Patent Title (中): 流量测量仪
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Application No.: US13043992Application Date: 2011-03-09
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Publication No.: US08347707B2Publication Date: 2013-01-08
- Inventor: Hiroyuki Uramachi , Koji Tanimoto , Yuji Ariyoshi , Masahiro Kawai , Shinichiro Hidaka , Naoyuki Kishikawa
- Applicant: Hiroyuki Uramachi , Koji Tanimoto , Yuji Ariyoshi , Masahiro Kawai , Shinichiro Hidaka , Naoyuki Kishikawa
- Applicant Address: JP Tokyo
- Assignee: Mitsubishi Electric Corporation
- Current Assignee: Mitsubishi Electric Corporation
- Current Assignee Address: JP Tokyo
- Agency: Sughrue Mion, PLLC
- Priority: JP2010-244910 20101101
- Main IPC: G01F1/68
- IPC: G01F1/68

Abstract:
Provided is a flow rate measuring apparatus which suppresses deformation of a base main body due to vibration of a pipe so as to be able to reduce occurrence of disconnection of wires due to the vibration of the pipe. The flow rate measuring apparatus includes a bonding portion (16) corresponding to a deformation suppression portion provided between an inner wall surface (17a) of a flange (17) of a base (11) and an outer circumferential wall surface (6a) of a cover (6) covering a circuit board (5), which is opposed to the inner wall surface (17a), for connecting the flange (17) and the cover (6) to suppress the deformation of a base main body (32) of the base (11) due to vibration of an intake pipe (50).
Public/Granted literature
- US20120103107A1 FLOW RATE MEASURING APPARATUS Public/Granted day:2012-05-03
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