Invention Grant
US08347723B2 Sonic resonator system for testing the adhesive bond strength of composite materials
失效
用于测试复合材料粘合剂粘合强度的声波谐振器系统
- Patent Title: Sonic resonator system for testing the adhesive bond strength of composite materials
- Patent Title (中): 用于测试复合材料粘合剂粘合强度的声波谐振器系统
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Application No.: US12800730Application Date: 2010-05-21
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Publication No.: US08347723B2Publication Date: 2013-01-08
- Inventor: Warren Questo , Robert W. Cribbs , Carl W. Hennige
- Applicant: Warren Questo , Robert W. Cribbs , Donna L. Cribbs, legal representative , Carl W. Hennige
- Applicant Address: US CA Cameron Park
- Assignee: Sonipulse, Inc.
- Current Assignee: Sonipulse, Inc.
- Current Assignee Address: US CA Cameron Park
- Agent Shirley L. Church, Esq.
- Main IPC: G01M7/02
- IPC: G01M7/02
Abstract:
Disclosed herein is a sonic resonator system for use in testing the adhesive bond strength of composite materials. Also disclosed herein are a method of calibrating the sonic resonator system to work with a particular composite bond joint, and a method of non-destructive testing the “pass-fail” of the bonded composite bond strength, based on a required bond strength.
Public/Granted literature
- US20110283767A1 Sonic resonator system for testing the adhesive bond strength of composite materials Public/Granted day:2011-11-24
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