Invention Grant
- Patent Title: Solder flux
- Patent Title (中): 焊剂通量
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Application No.: US12692160Application Date: 2010-01-22
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Publication No.: US08348135B2Publication Date: 2013-01-08
- Inventor: Frank Timothy Lawrence
- Applicant: Frank Timothy Lawrence
- Applicant Address: GB Hertfordshire
- Assignee: Henkel Limited
- Current Assignee: Henkel Limited
- Current Assignee Address: GB Hertfordshire
- Agent Steven C. Bauman
- Priority: IE2007/0530 20070723
- Main IPC: B23K31/12
- IPC: B23K31/12 ; B23K35/24

Abstract:
A soldering flux composition comprising: (i) a carrier vehicle comprising a solvent; (ii) an activator component for activating a metal surface for soldering; (iii) a color-imparting component with an appropriate color to facilitate optical detection of flux on the fluxed component; and optionally (iv) a gelling component to control flux rheology. The color-imparting component is utilized to indicate the presence of desired amounts of flux. A component with inadequate flux for reliable soldering can be rejected.
Public/Granted literature
- US20100143658A1 SOLDER FLUX Public/Granted day:2010-06-10
Information query
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