Connections can be made to microwires comprising a conductor of a lower melting point metal (e.g., indium 290) in a sheath of higher melting point polymer (e.g., PETG) by placing a small diameter spring, slightly larger in inside diameter than the outer diameter of the microwire, and of a readily solderable material over the distal end of the microwire. The conductor of the microwire is then soldered to the distal end of the spring in any of several ways that result in a solid member at the distal end of the microwire. The flexible spring provides a flexible support for the microwire, so that as the microwire flexes in use, the spring provides a strain relief; that is, the proximal portion of the spring flexes along with the microwire, so that the microwire bends over some distance rather than at a single point.