Invention Grant
- Patent Title: Printhead die
- Patent Title (中): 打印头模具
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Application No.: US13149014Application Date: 2011-05-31
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Publication No.: US08348385B2Publication Date: 2013-01-08
- Inventor: Trudy Benjamin , Joseph M. Torgerson
- Applicant: Trudy Benjamin , Joseph M. Torgerson
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/145
- IPC: B41J2/145 ; B41J2/15

Abstract:
A printhead die that includes first and second slots through the die for feeding a same liquid, the slots offset from each other along two axes. The die has a first nozzle package adjacent one side of the first slot and extending toward the second slot along the minor axis. The die includes a second nozzle package adjacent an opposite side of the second slot and extending toward the first slot along the minor axis. The first and second nozzle packages each have a slanted corner profile.
Public/Granted literature
- US20120306968A1 PRINTHEAD DIE Public/Granted day:2012-12-06
Information query
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