Invention Grant
- Patent Title: Fluid ejection device
- Patent Title (中): 流体喷射装置
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Application No.: US13156770Application Date: 2011-06-09
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Publication No.: US08348396B2Publication Date: 2013-01-08
- Inventor: Jeffrey R. Pollard
- Applicant: Jeffrey R. Pollard
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Main IPC: B41J2/045
- IPC: B41J2/045

Abstract:
A fluid ejection device includes a flexible membrane and an adhesive layer on the flexible membrane. The adhesive layer includes a first region and a second region extending from the first region. The fluid ejection device includes a piezoelectric material layer including an edge region and a central region. A surface of the edge region of the piezoelectric material layer is substantially coplanar with a surface of the second region of the adhesive layer. The surface of the edge region and the surface of the second region are substantially parallel with the flexible membrane.
Public/Granted literature
- US20120314006A1 FLUID EJECTION DEVICE Public/Granted day:2012-12-13
Information query
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