Invention Grant
- Patent Title: LED lamp assembly
- Patent Title (中): LED灯组件
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Application No.: US12647779Application Date: 2009-12-28
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Publication No.: US08348471B2Publication Date: 2013-01-08
- Inventor: Tsung-Chin Huang , Chang Hung Peng
- Applicant: Tsung-Chin Huang , Chang Hung Peng
- Applicant Address: TW Taipei Hsien
- Assignee: Cooler Master Co., Ltd.
- Current Assignee: Cooler Master Co., Ltd.
- Current Assignee Address: TW Taipei Hsien
- Agency: Rosenberg, Klein & Lee
- Priority: TW97223550U 20081229
- Main IPC: F21V29/00
- IPC: F21V29/00 ; F21V21/00 ; F21S4/00

Abstract:
A LED lamp assembly is disclosed. The LED lamp assembly includes a heat radiator, a base body and a cover body. The base body is located on one end of the heat radiator and the cover body is located on the other end of the heat radiator. The base body has a plurality of first engaging parts, each of which is associated with a first engaging portion. The cover body has a plurality of second engaging parts, each of which is associated with a second engaging portion. The first engaging portion is configured to correspond to and engage with the second engaging portion so as to sandwich the heat radiator between the base body and the cover body.
Public/Granted literature
- US20100164348A1 LED LAMP ASSEMBLY Public/Granted day:2010-07-01
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