Invention Grant
- Patent Title: System for active array temperature sensing and cooling
- Patent Title (中): 有源阵列温度传感和冷却系统
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Application No.: US11764703Application Date: 2007-06-18
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Publication No.: US08348503B2Publication Date: 2013-01-08
- Inventor: Thomas P. Brody , Paul R. Malmberg , Joseph A. Marcanio
- Applicant: Thomas P. Brody , Paul R. Malmberg , Joseph A. Marcanio
- Applicant Address: BV Tortola
- Assignee: Advantech Global, Ltd.
- Current Assignee: Advantech Global, Ltd.
- Current Assignee Address: BV Tortola
- Agency: Dickstein Shapiro LLP
- Main IPC: G01K3/00
- IPC: G01K3/00

Abstract:
A system and method for providing an active array of temperature sensing and cooling elements, including an active heatsink which further includes an active temperature sensing layer, a thermoelectric cooling layer, and a heatsink, which further includes a plurality of cooling channels. The temperature sensing element within the active temperature sensing layer includes a plurality of switching transistors, a linear transistor, a current sense resistor, a thermistor, a voltage sensing bus, a voltage setting bus, a current measurement bus, a measurement switching bus, a sense control bus, a storage capacitor, and a supply voltage, all under the control of a process control computer. The method of using an active array of temperature sensing and cooling elements includes the steps of aligning the shadow mask, depositing the material, detecting a thermal gradient, and controlling the thermoelectric cooling.
Public/Granted literature
- US20070235731A1 SYSTEM FOR AND METHOD OF ACTIVE ARRAY TEMPERATURE SENSING AND COOLING Public/Granted day:2007-10-11
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