Invention Grant
- Patent Title: High density front panel optical interconnect
- Patent Title (中): 高密度前面板光互连
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Application No.: US12368832Application Date: 2009-02-10
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Publication No.: US08348516B2Publication Date: 2013-01-08
- Inventor: Richard F. Roth
- Applicant: Richard F. Roth
- Applicant Address: US CT Wallingford
- Assignee: Amphenol Corporation
- Current Assignee: Amphenol Corporation
- Current Assignee Address: US CT Wallingford
- Agency: Blank Rome LLP
- Main IPC: G02B6/36
- IPC: G02B6/36

Abstract:
A connector assembly has a cable assembly, plug assembly and a socket assembly. The socket assembly is a female member which is received within an opening at the front face of a panel. The plug assembly is a male member which then engages the socket at the front face of the panel. The cable assembly connects the cables carrying optical fibers to the plug assembly. As the socket assembly receives the plug assembly, doors on the respective housings open and ferrule carriers carried by the socket and plug assemblies mate. The plug assembly has a movable front end which permits the fibers to move in both horizontal and vertical directions.
Public/Granted literature
- US20100202736A1 HIGH DENSITY FRONT PANEL OPTICAL INTERCONNECT Public/Granted day:2010-08-12
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