Invention Grant
- Patent Title: Heat dissipating device and bracket thereof
- Patent Title (中): 散热装置及其支架
-
Application No.: US12412389Application Date: 2009-03-27
-
Publication No.: US08348607B2Publication Date: 2013-01-08
- Inventor: Lei Liu , Xiao-Feng Ma
- Applicant: Lei Liu , Xiao-Feng Ma
- Applicant Address: CN Shenzhen TW New Taipei
- Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hong Fu Jin Precision Industry (ShenZhen) Co., Ltd.,Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: CN Shenzhen TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: CN200910300610 20090227
- Main IPC: F01D25/26
- IPC: F01D25/26
Abstract:
A heat dissipating device includes a heat dissipating element and a bracket. The bracket includes a first fixing portion and a second fixing portion. The first fixing portion is to fix the heating dissipating element. The second fixing portion is movably mounted to the first fixing portion. The second fixing portion is configured to fix the bracket to another apparatus to adjust a distance between the heat dissipating element and the apparatus.
Public/Granted literature
- US20100218913A1 HEAT DISSIPATING DEVICE AND BRACKET THEREOF Public/Granted day:2010-09-02
Information query
