Invention Grant
- Patent Title: Guide wire
- Patent Title (中): 导丝
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Application No.: US13247414Application Date: 2011-09-28
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Publication No.: US08348860B2Publication Date: 2013-01-08
- Inventor: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
- Applicant: Hiraku Murayama , Akihiko Umeno , Jun Iwami , Yutaka Itou , Youki Aimi
- Applicant Address: JP Shibuya-Ku, Tokyo
- Assignee: Terumo Kabushiki Kaisha
- Current Assignee: Terumo Kabushiki Kaisha
- Current Assignee Address: JP Shibuya-Ku, Tokyo
- Agency: Buchanan Ingersoll & Rooney PC
- Priority: JP2002-244316 20020823; JP2002-355907 20021206; JP2003-156010 20030530
- Main IPC: A61B5/00
- IPC: A61B5/00

Abstract:
A method of making a guide wire involves butting a connection end face at a proximal end of a first wire against a connection end face at a distal end of a second wire while applying voltage and a pressing force to weld together the first and second wires at a welded portion. The welded portion forms a projection that projects outwardly in an outer peripheral direction relative to portions of the first and second wire adjacent the projection. The outer dimension of the projection at the welded portion is adjusted so that upon completing adjusting the outer dimension of the projection the projection still projects outwardly in the outer peripheral direction relative to the portions of the first and second wire adjacent the projection.
Public/Granted literature
- US20120022503A1 GUIDE WIRE Public/Granted day:2012-01-26
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