Invention Grant
US08349078B2 Method of forming nitride semiconductor epitaxial layer and method of manufacturing nitride semiconductor device
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形成氮化物半导体外延层的方法和制造氮化物半导体器件的方法
- Patent Title: Method of forming nitride semiconductor epitaxial layer and method of manufacturing nitride semiconductor device
- Patent Title (中): 形成氮化物半导体外延层的方法和制造氮化物半导体器件的方法
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Application No.: US12913062Application Date: 2010-10-27
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Publication No.: US08349078B2Publication Date: 2013-01-08
- Inventor: Hiromu Shiomi , Yu Saitoh , Kazuhide Sumiyoshi , Akihiro Hachigo , Makoto Kiyama , Seiji Nakahata
- Applicant: Hiromu Shiomi , Yu Saitoh , Kazuhide Sumiyoshi , Akihiro Hachigo , Makoto Kiyama , Seiji Nakahata
- Applicant Address: JP Osaka-Shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-Shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2010-010158 20100120
- Main IPC: C30B25/20
- IPC: C30B25/20 ; C30B25/22 ; C30B29/40 ; H01L21/306

Abstract:
The present method of forming a nitride semiconductor epitaxial layer includes the steps of growing at least one layer of nitride semiconductor epitaxial layer on a nitride semiconductor substrate having a dislocation density lower than or equal to 1×107 cm−2 with a chemical decomposition layer interposed therebetween, the chemical decomposition layer being chemically decomposed at least with either a gas or an electrolytic solution, and decomposing the chemical decomposition layer at least with either the gas or the electrolytic solution at least either during or after the step of growing the nitride semiconductor epitaxial layer, thereby separating the nitride semiconductor epitaxial layer from the nitride semiconductor substrate. A high-quality nitride semiconductor epitaxial layer suffering less damage when separated from the nitride semiconductor substrate is thereby formed.
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