Invention Grant
- Patent Title: Method and assembly for validating bond line
- Patent Title (中): 验证接合线的方法和装配
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Application No.: US12220032Application Date: 2008-07-21
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Publication No.: US08349104B2Publication Date: 2013-01-08
- Inventor: John H. Vontell, Sr.
- Applicant: John H. Vontell, Sr.
- Applicant Address: US CT Hartford
- Assignee: United Technologies Corporation
- Current Assignee: United Technologies Corporation
- Current Assignee Address: US CT Hartford
- Agency: Kinney & Lange, P.A.
- Main IPC: B29C65/82
- IPC: B29C65/82
Abstract:
A method includes positioning a layer of adhesive between a first structural component and a second structural component, positioning a first evaluation film between the first structural component and the layer of adhesive, curing the adhesive at least partially, separating the first structural component and the first evaluation film by a relative movement therebetween, and inspecting bond line quality of the adhesive.
Public/Granted literature
- US20100015455A1 Method and assembly for validating bond line Public/Granted day:2010-01-21
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