Invention Grant
- Patent Title: Adhesive tape joining method and adhesive tape joining apparatus
- Patent Title (中): 胶带接合方法和胶带接合装置
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Application No.: US12848290Application Date: 2010-08-02
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Publication No.: US08349106B2Publication Date: 2013-01-08
- Inventor: Saburo Miyamoto , Yukitoshi Hase , Masayuki Yamamoto
- Applicant: Saburo Miyamoto , Yukitoshi Hase , Masayuki Yamamoto
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Cheng Law Group, PLLC
- Priority: JP2009-200315 20090831
- Main IPC: B32B41/00
- IPC: B32B41/00

Abstract:
A joint detector detects a joint in an adhesive tape supplied from a tape supply section, and a computing unit determines a suitable cutting position of the adhesive tape for removing the joint in accordance with the detected results. A controller controls each mechanism to operate so as to satisfy the determined results by the computing unit. Thereafter, the adhesive tape including the joint is cut and removed.
Public/Granted literature
- US20110048609A1 ADHESIVE TAPE JOINING METHOD AND ADHESIVE TAPE JOINING APPARATUS Public/Granted day:2011-03-03
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