Invention Grant
- Patent Title: Method and apparatus for debonding a submounted substrate
- Patent Title (中): 用于剥离底层基板的方法和装置
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Application No.: US12921871Application Date: 2009-03-25
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Publication No.: US08349129B2Publication Date: 2013-01-08
- Inventor: Robert Blanchard , R. Steve Rednour , Douglas Loy
- Applicant: Robert Blanchard , R. Steve Rednour , Douglas Loy
- Applicant Address: US AZ Scottsdale
- Assignee: Arizona Board of Regents, a body corporate of the State of Arizona acting for and on behalf of Arizona State University
- Current Assignee: Arizona Board of Regents, a body corporate of the State of Arizona acting for and on behalf of Arizona State University
- Current Assignee Address: US AZ Scottsdale
- Agency: McDonell Boehnen Hulbert & Berghoff LLP
- International Application: PCT/US2009/038275 WO 20090325
- International Announcement: WO2009/126443 WO 20091015
- Main IPC: B29C63/00
- IPC: B29C63/00 ; B32B38/10
Abstract:
The present invention provides a debonding apparatus, a system comprising such apparatus, and methods for using such apparatus or system for the removal of flexible substrates (14) post-processing without damage to fabricated devices.
Public/Granted literature
- US20110023672A1 Method and Apparatus for Debonding a Submounted Substrate Public/Granted day:2011-02-03
Information query
