Invention Grant
- Patent Title: Method for manufacturing a perpendicular magnetic write head having a tapered write pole and non-magnetic bump structure
- Patent Title (中): 具有锥形写磁极和非磁性凸块结构的垂直写磁头的制造方法
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Application No.: US12623206Application Date: 2009-11-20
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Publication No.: US08349197B2Publication Date: 2013-01-08
- Inventor: Liubo Hong , Wen-Chien D. Hsiao , Yimin Hsu , Yi Zheng
- Applicant: Liubo Hong , Wen-Chien D. Hsiao , Yimin Hsu , Yi Zheng
- Applicant Address: NL Amsterdam
- Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee: Hitachi Global Storage Technologies Netherlands B.V.
- Current Assignee Address: NL Amsterdam
- Agency: Zilka-Kotab, PC
- Main IPC: B44C1/22
- IPC: B44C1/22

Abstract:
A method for manufacturing a magnetic write head having a write pole and a trailing wrap around magnetic shield, and having a non-magnetic step layer and a non-magnetic bump to provide additional spacing between the write pole and the trailing wrap around shield at a location removed from the air bearing surface. A magnetic write pole material is deposited on a substrate and a non-magnetic step layer is deposited over the write pole. A reactive ion milling can he used to pattern the non-magnetic step layer to have a front edge that is located a desired distance from an air hearing surface. A patterning and ion milling process is then performed to define a write pole, and then a layer of alumina is deposited and ion milled to from a tapered, non-magnetic bump at the front the non-magnetic step layer.
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