Invention Grant
US08349240B2 Hidden parting line mold and hidden parting line molding technique using associated part removal device
有权
隐藏分模线模具和隐藏分型线成型技术,采用相关零件拆卸装置
- Patent Title: Hidden parting line mold and hidden parting line molding technique using associated part removal device
- Patent Title (中): 隐藏分模线模具和隐藏分型线成型技术,采用相关零件拆卸装置
-
Application No.: US13071817Application Date: 2011-03-25
-
Publication No.: US08349240B2Publication Date: 2013-01-08
- Inventor: Patrick Smith
- Applicant: Patrick Smith
- Applicant Address: JP Tokyo
- Assignee: Honda Motor Co., Ltd.
- Current Assignee: Honda Motor Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Standley Law Group LLP
- Main IPC: B29C45/42
- IPC: B29C45/42 ; B29C45/44

Abstract:
An injection mold and a cooperating molding system and method that allows for the parting line of a molded vehicle bumper fascia to be hidden within the wheel arch portion thereof. The invention contemplates two different mold designs for producing such a parting line: a double-lifter design and a collapsing slide core design. The bumper fascia remains in the cavity portion of the mold after molding due to the presence of undercuts in the mold cavity. A robotic part removal device is used to remove the molded bumper fascia from the mold cavity after mold opening. The part removal device is adapted to temporarily deform the bumper fascia in the wheel arch flange areas thereof to facilitate its removal from the cavity.
Public/Granted literature
- US20120242004A1 HIDDEN PARTING LINE MOLD AND HIDDEN PARTING LINE MOLDING TECHNIQUE USING ASSOCIATED PART REMOVAL DEVICE Public/Granted day:2012-09-27
Information query
IPC分类: