In an injection molding apparatus comprising a clamp plate, a heated manifold and a mold, a system for mounting an actuator to the manifold and the clamp plate, the system comprising: a mount comprised of a thermally conductive material having first and second heat conductive surfaces; the first conductive surface being in heat conductive communication with the actuator, the second conductive surface being in heat conductive communication with the clamp plate; the actuator being mounted in thermal communication with the manifold; the mount being adjustably mounted to the actuator such that the second conductive surface can be adjusted in position toward and away from the actuator.