Invention Grant
- Patent Title: Adhesive patch and adhesive preparation
- Patent Title (中): 粘合剂贴剂和粘合剂制备
-
Application No.: US13224075Application Date: 2011-09-01
-
Publication No.: US08349357B1Publication Date: 2013-01-08
- Inventor: Jun Harima , Masakatsu Konno , Ryo Hashino , Akira Numata
- Applicant: Jun Harima , Masakatsu Konno , Ryo Hashino , Akira Numata
- Applicant Address: JP Ibaraki-shi, Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Ibaraki-shi, Osaka
- Agency: Leydig, Voit & Mayer, Ltd.
- Main IPC: A61L15/16
- IPC: A61L15/16

Abstract:
The present invention provides an adhesive patch comprising a support, an adhesive layer on at least one surface of the support, and a release liner on a surface of the adhesive layer opposite from the support, wherein(a) the lateral end of the adhesive layer is exposed,(b) in at least one lateral end, the lateral end of the adhesive layer is located toward the central part side of the adhesive patch from the lateral end of the support, and(c) when placed horizontally with the release liner facing down, a distance A between the upper end of the support and the lower end of the release liner at said lateral end of the adhesive patch is greater than a thickness B of the central part of the adhesive patch.
Information query