Invention Grant
- Patent Title: Vapor-phase process apparatus, vapor-phase process method, and substrate
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Application No.: US13231446Application Date: 2011-09-13
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Publication No.: US08349403B2Publication Date: 2013-01-08
- Inventor: Eiryo Takasuka , Toshio Ueda , Toshiyuki Kuramoto , Masaki Ueno
- Applicant: Eiryo Takasuka , Toshio Ueda , Toshiyuki Kuramoto , Masaki Ueno
- Applicant Address: JP Osaka-shi, Osaka
- Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee: Sumitomo Electric Industries, Ltd.
- Current Assignee Address: JP Osaka-shi, Osaka
- Agency: Drinker Biddle & Reath LLP
- Priority: JP2007-319735 20071211; JP2007-326001 20071218; JP2008-221600 20080829; JP2008-232493 20080910
- Main IPC: C23C16/00
- IPC: C23C16/00 ; C23C16/455 ; H01L21/302

Abstract:
A vapor-phase process apparatus and a vapor-phase process method capable of satisfactorily maintaining quality of processes even when different types of processes are performed are obtained. A vapor-phase process apparatus includes a process chamber, gas supply ports serving as a plurality of gas introduction portions, and a gas supply portion (a gas supply member, a pipe, a flow rate control device, a pipe, and a buffer chamber). The process chamber allows flow of a reaction gas therein. The plurality of gas supply ports are formed in a wall surface (upper wall) of the process chamber along a direction of flow of the reaction gas. The gas supply portion can supply a gas into the process chamber at a different flow rate from each of one gas supply port and another gas supply port different from that one gas supply port among the plurality of gas supply ports.
Public/Granted literature
- US20120003142A1 VAPOR-PHASE PROCESS APPARATUS, VAPOR-PHASE PROCESS METHOD, AND SUBSTRATE Public/Granted day:2012-01-05
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