A multi-layer plate member bonding structure includes a first plate member having a binding unit protruded from the top surface thereof, a second plate member having one open chamber cut through opposing outer face and bonding face thereof corresponding to the binding unit of the first plate member, and an adhesive filled up the open chamber and cured to form a first stop portion in the relatively greater upper part of the open chamber and a second stop portion in the relatively smaller lower part of the open chamber to secure the first plate member and the second plate member firmly together.