Invention Grant
US08349460B2 Organosilicon copolymer composites, method of manufacture, and articles formed therefrom
有权
有机硅共聚物复合材料，制造方法和由其形成的制品
- Patent Title: Organosilicon copolymer composites, method of manufacture, and articles formed therefrom
- Patent Title (中): 有机硅共聚物复合材料，制造方法和由其形成的制品
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Application No.: US12575861Application Date: 2009-10-08
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Publication No.: US08349460B2Publication Date: 2013-01-08
- Inventor: Sankar K. Paul
- Applicant: Sankar K. Paul
- Applicant Address: US IL Lincolnwood
- Assignee: World Properties, Inc.
- Current Assignee: World Properties, Inc.
- Current Assignee Address: US IL Lincolnwood
- Agency: Cantor Colburn LLP
- Main IPC: B32B27/00
- IPC: B32B27/00 ; C08L83/00 ; C08K3/18 ; C08K3/20 ; C08K3/22 ; C08K3/34 ; C08K3/38
Abstract:
Organosilicon composites are described, comprising 30 to 90 vol. % of a cured organosilicon copolymer derived by curing an organosilicon polymer having, in the same copolymer, silicon-containing repeating units comprising a silicon hydride and silicon-containing repeating units comprising a C1-10 ethylenically unsaturated group; and 10 to 70 vol. % of a dielectric filler. The composites are used in the manufacture of circuit subassemblies.
Public/Granted literature
- US20100255319A1 ORGANOSILICON COPOLYMER COMPOSITES, METHOD OF MANUFACTURE, AND ARTICLES FORMED THEREFROM Public/Granted day:2010-10-07
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