Invention Grant
- Patent Title: Method for fabricating thin film transistor array substrate
- Patent Title (中): 薄膜晶体管阵列基板的制造方法
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Application No.: US13225568Application Date: 2011-09-06
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Publication No.: US08349631B2Publication Date: 2013-01-08
- Inventor: Shine-Kai Tseng , Han-Tu Lin , Shiun-Chang Jan , Kuo-Lung Fang
- Applicant: Shine-Kai Tseng , Han-Tu Lin , Shiun-Chang Jan , Kuo-Lung Fang
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: Jianq Chyun IP Office
- Priority: TW97125980A 20080709
- Main IPC: H01L21/338
- IPC: H01L21/338 ; H01L31/112

Abstract:
A method for fabricating a TFT array substrate includes following steps. A gate pattern and a first pad pattern are formed on a substrate. A gate insulation layer and a semiconductor layer covering the two patterns are sequentially formed. A patterned photoresist layer having different resist blocks is formed, and patterns and thicknesses of the resist blocks in different regions are adjusted. The semiconductor layer and the gate insulation layer above the first pad pattern are removed through performing an etching process and reducing a thickness of the patterned photoresist layer. After removing the patterned photoresist layer, a source pattern, a drain pattern, and a second pad pattern electrically connected to the first pad pattern are formed. A patterned passivation layer is formed on the gate insulation layer and has a second opening exposing the source pattern or the drain pattern and a third opening exposing the second pad pattern.
Public/Granted literature
- US20110318856A1 METHOD FOR FABRICATING THIN FILM TRANSISTOR ARRAY SUBSTRATE Public/Granted day:2011-12-29
Information query
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