Invention Grant
- Patent Title: Method of manufacturing back illuminated solid-state imaging device with improved transmittance of visible light
- Patent Title (中): 制造具有改善的可见光透射率的背照式固态成像装置的方法
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Application No.: US13137210Application Date: 2011-07-28
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Publication No.: US08349638B2Publication Date: 2013-01-08
- Inventor: Hideo Kanbe , Takayuki Ezaki
- Applicant: Hideo Kanbe , Takayuki Ezaki
- Applicant Address: JP Tokyo
- Assignee: Sony Corporation
- Current Assignee: Sony Corporation
- Current Assignee Address: JP Tokyo
- Agency: Rader Fishman & Grauer, PLLC
- Priority: JP2004-233760 20040810
- Main IPC: H01L31/18
- IPC: H01L31/18

Abstract:
To provide a solid-state imaging device able to improve light transmittance of a transparent insulation film in a light incident side of a substrate, suppress the dark current, and prevent a quantum efficiently loss, wherein a pixel circuit is formed in a first surface of the substrate and light is received from a second surface, and having: a light receiving unit formed in the substrate and for generating a signal charge corresponding to an amount of incidence light and storing it; a transparent first insulation film formed on the second surface; and a transparent second insulation film formed on the first insulation film and for retaining a charge having the same polarity as the signal charge in an interface of the first insulation film or in inside, thicknesses of the first and second insulation film being determined to obtain a transmittance higher than when using only the first insulation film.
Public/Granted literature
- US20110287569A1 Solid-state imaging device, method of producing the same, and camera Public/Granted day:2011-11-24
Information query
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