Invention Grant
- Patent Title: Semiconductor wafer for semiconductor components and production method
- Patent Title (中): 半导体晶圆半导体元件及生产方法
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Application No.: US12949332Application Date: 2010-11-18
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Publication No.: US08349646B2Publication Date: 2013-01-08
- Inventor: Hans-Joachim Schulze
- Applicant: Hans-Joachim Schulze
- Applicant Address: AT Villach
- Assignee: Infineon Technologies Austria AG
- Current Assignee: Infineon Technologies Austria AG
- Current Assignee Address: AT Villach
- Agency: Dicke, Billig & Czaja, PLLC
- Main IPC: H01L21/322
- IPC: H01L21/322 ; H01L21/06

Abstract:
A semiconductor wafer for semiconductor components and to a method for its production is disclosed. In one embodiment, the semiconductor wafer includes a front side with an adjoining near-surface active zone as basic material for semiconductor component structures. The rear side of the semiconductor wafer is adjoined by a getter zone for gettering impurity atoms in the semiconductor wafer. The getter zone contains oxygen precipitates. In the near-surface active zone, atoms of doping material are located on lattice vacancies. The atoms of doping material have a higher diffusion coefficient that the oxygen atoms.
Public/Granted literature
- US20110062558A1 SEMICONDUCTOR WAFER FOR SEMICONDUCTOR COMPONENTS AND PRODUCTION METHOD Public/Granted day:2011-03-17
Information query
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