Invention Grant
- Patent Title: Method of fabricating stacked packages with bridging traces
- Patent Title (中): 制造具有桥接迹线的堆叠封装的方法
-
Application No.: US13115318Application Date: 2011-05-25
-
Publication No.: US08349654B2Publication Date: 2013-01-08
- Inventor: Belgacem Haba
- Applicant: Belgacem Haba
- Applicant Address: US CA San Jose
- Assignee: Tessera, Inc.
- Current Assignee: Tessera, Inc.
- Current Assignee Address: US CA San Jose
- Agency: Lerner, David, Littenberg, Krumholz & Mentlik, LLP
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/34
Abstract:
A microelectronic assembly that includes a first microelectronic element having a first rear surface. The assembly further includes a second microelectronic element having a second rear surface. The second microelectronic element is attached to the first microelectronic element so as to form a stacked package. A bridging element electrically connects the first microelectronic element and the second microelectronic element. The first rear surface of the first microelectronic element faces toward the second rear surface of the second microelectronic element.
Public/Granted literature
- US20110230013A1 STACKED PACKAGES WITH BRIDGING TRACES Public/Granted day:2011-09-22
Information query
IPC分类:
