Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
- Patent Title (中): 半导体装置及其制造方法
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Application No.: US12648218Application Date: 2009-12-28
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Publication No.: US08349677B2Publication Date: 2013-01-08
- Inventor: Woo Young Chung
- Applicant: Woo Young Chung
- Applicant Address: KR Icheon-Si
- Assignee: Hynix Semiconductor Inc.
- Current Assignee: Hynix Semiconductor Inc.
- Current Assignee Address: KR Icheon-Si
- Priority: KR10-2009-0054014 20090617
- Main IPC: H01L21/336
- IPC: H01L21/336 ; H01L21/8234

Abstract:
A semiconductor device is fabricated by forming a semiconductor substrate as a convex shape to increase a effective channel of a transistor and by stacking a first silicon germanium layer and a first silicon layer on the semiconductor substrate to form a first layer and stacking a second silicon germanium layer and a second silicon layer on the first layer to form a second layer such that the current reduced due to the increased effective channel is ensured, thereby being capable of high speed performance.
Public/Granted literature
- US20100320511A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2010-12-23
Information query
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