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US08349677B2 Semiconductor device and method for manufacturing the same 失效
半导体装置及其制造方法

Semiconductor device and method for manufacturing the same
Abstract:
A semiconductor device is fabricated by forming a semiconductor substrate as a convex shape to increase a effective channel of a transistor and by stacking a first silicon germanium layer and a first silicon layer on the semiconductor substrate to form a first layer and stacking a second silicon germanium layer and a second silicon layer on the first layer to form a second layer such that the current reduced due to the increased effective channel is ensured, thereby being capable of high speed performance.
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