A method for manufacturing a semiconductor device 1, comprising a first step of providing a photosensitive adhesive (insulating resin layer 7) on a board 3 which has a connecting terminal, a second step of patterning the photosensitive adhesive by light exposure and development so that openings 13 are formed where the connecting terminal is exposed, a third step of filling the openings 13 with a conductive material to form a conductive layer 9, and a fourth step of directly bonding a semiconductor chip 5 having a connecting electrode section to the photosensitive adhesive while electrically connecting the connecting terminal of the board 3 and the connecting electrode section of the semiconductor chip 5 via the conductive layer 9.