Invention Grant
- Patent Title: Process for making contact with and housing integrated circuits
- Patent Title (中): 与集成电路接触和接收的过程
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Application No.: US12894378Application Date: 2010-09-30
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Publication No.: US08349707B2Publication Date: 2013-01-08
- Inventor: Dipl.-Ing. Florian Bieck , Jürgen Leib
- Applicant: Dipl.-Ing. Florian Bieck , Jürgen Leib
- Applicant Address: US CA Cupertino
- Assignee: Wafer-Level Packaging Portfolio LLC
- Current Assignee: Wafer-Level Packaging Portfolio LLC
- Current Assignee Address: US CA Cupertino
- Agent Edward P. Heller, III
- Priority: DE10141558 20010824; DE10141571 20010824; DE10225373 20020606
- Main IPC: H01L21/30
- IPC: H01L21/30
Abstract:
A process for producing electrical contact connections for a component integrated in a substrate material is provided, the substrate material having a first surface region, and at least one terminal contact being arranged at least partially in the first surface region for each component, which is distinguished in particular by application of a covering to the first surface region and production of at least one contact passage which, in the substrate material, runs transversely with respect to the first surface region, in which process, in order to form at least one contact location in a second surface region which is to be provided, at least one electrical contact connection from the contact location to at least one of the terminal contacts is produced via the respective contact passages.
Public/Granted literature
- US20110021002A1 Process for Making Contact with and Housing Integrated Circuits Public/Granted day:2011-01-27
Information query
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