Invention Grant
- Patent Title: Layer assembly
- Patent Title (中): 层组装
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Application No.: US13076166Application Date: 2011-03-30
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Publication No.: US08349712B2Publication Date: 2013-01-08
- Inventor: André Strittmatter , Andrei Schliwa , Tim David Germann , Udo W. Pohl , Vladimir Gaysler , Jan-Hindrik Schulze
- Applicant: André Strittmatter , Andrei Schliwa , Tim David Germann , Udo W. Pohl , Vladimir Gaysler , Jan-Hindrik Schulze
- Applicant Address: DE Berlin
- Assignee: Technische Universitat Berlin
- Current Assignee: Technische Universitat Berlin
- Current Assignee Address: DE Berlin
- Agency: Foley & Lardner LLP
- Main IPC: H01L21/20
- IPC: H01L21/20 ; H01L21/36

Abstract:
The invention inter alia relates to a method of fabricating a layer assembly comprising the steps of: arranging a first layer on top of a carrier; arranging a second layer on top of the first layer; locally modifying the material of the buried first layer and providing at least one modified section in the first layer, wherein the modified material changes or induces mechanical strain in a portion of the second layer which is arranged above the at least one modified section; after locally modifying the material of the buried first layer, depositing a third material on top of the second layer, at least one characteristic of the third material being sensitive to the local mechanical strain in the second layer.
Public/Granted literature
- US20120248403A1 LAYER ASSEMBLY Public/Granted day:2012-10-04
Information query
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