A manufacturing method of a substrate with through electrodes, comprising a substrate having through holes, and through electrodes received in the through holes, includes a through electrode formation step of forming the through electrodes on a support plate, a substrate formation step of forming the substrate, a through electrode reception step of stacking the substrate on the support plate 45 and receiving the through electrodes in the through holes, a resin filling step of filling gaps between side surfaces of the through electrodes and inner walls of the through holes of the substrate 11 with a resin, and a support plate removal step of removing the support plate after the resin filling step.