Invention Grant
- Patent Title: Metal particle dispersion structure, microparticles comprising this structure, articles coated with this structure, and methods of producing the preceding
- Patent Title (中): 金属颗粒分散结构，包含该结构的微粒，用该结构涂覆的制品，以及制造前述的方法
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Application No.: US12682292Application Date: 2008-10-09
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Publication No.: US08349928B2Publication Date: 2013-01-08
- Inventor: Yukinari Harimoto
- Applicant: Yukinari Harimoto
- Applicant Address: JP Tokyo
- Assignee: Dow Corning Toray Co., Ltd.
- Current Assignee: Dow Corning Toray Co., Ltd.
- Current Assignee Address: JP Tokyo
- Agency: Howard & Howard Attorneys PLLC
- Priority: JP2007-265528 20071011
- International Application: PCT/JP2008/068815 WO 20081009
- International Announcement: WO2009/048169 WO 20090416
- Main IPC: C08G77/50
- IPC: C08G77/50
Abstract:
A metal particle dispersion structure characteristically comprising (B) 0.005 to 100 weight parts of metal nanoparticles dispersed in (A) 100 weight parts of polymerized polymer, wherein the metal nanoparticles are metal particles obtained by mixing (b1) organohydrogenpolysiloxane and (b2) at least one metal compound which is soluble in component (b3) to uniformity in (b3) cyclic or chain dimethylpolysiloxane or at least one organic solvent.
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