Invention Grant
- Patent Title: Wound treatment apparatus employing reduced pressure
- Patent Title (中): 使用减压的伤口治疗仪
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Application No.: US12199695Application Date: 2008-08-27
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Publication No.: US08350115B2Publication Date: 2013-01-08
- Inventor: Keith Patrick Heaton , Kenneth William Hunt
- Applicant: Keith Patrick Heaton , Kenneth William Hunt
- Applicant Address: US TX San Antonio
- Assignee: KCI Licensing, Inc.
- Current Assignee: KCI Licensing, Inc.
- Current Assignee Address: US TX San Antonio
- Priority: GB9909301.5 19990422
- Main IPC: A61F13/00
- IPC: A61F13/00 ; A61F5/00

Abstract:
An apparatus for stimulating healing of a wound, includes a porous pad adapted to contact a surface of the wound on an affected part of a body. An envelope for receiving the porous pad and the affected part of the body is provided, and the envelope includes a re-sealable opening that permits the wound to be inspected. A connector is fluidly connected to an interior of the envelope and to a source of negative pressure.
Public/Granted literature
- US20080312613A1 WOUND TREATMENT APPARATUS EMPLOYING REDUCED PRESSURE Public/Granted day:2008-12-18
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