Invention Grant
- Patent Title: Enclosure of electronic device
- Patent Title (中): 电子设备外壳
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Application No.: US12860941Application Date: 2010-08-23
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Publication No.: US08350150B2Publication Date: 2013-01-08
- Inventor: Chien-Hung Liu , Po-Chuan Hsieh , Yu-Chang Pai
- Applicant: Chien-Hung Liu , Po-Chuan Hsieh , Yu-Chang Pai
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99118299 20100607
- Main IPC: H05K5/00
- IPC: H05K5/00
Abstract:
An enclosure of an electronic device includes a plate. The plate defines a number of through holes. Each through hole has a pair of tabs connected to each other and with the through hole. Each pair of tabs are slantingly bent towards an inside of the enclosure. The enclosure with the shields can shield the electronic device from electro-magnetic interference.
Public/Granted literature
- US20110297413A1 ENCLOSURE OF ELECTRONIC DEVICE Public/Granted day:2011-12-08
Information query
