Invention Grant
- Patent Title: Printed circuit board
- Patent Title (中): 印刷电路板
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Application No.: US12870999Application Date: 2010-08-30
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Publication No.: US08350157B2Publication Date: 2013-01-08
- Inventor: Ying-Tso Lai , Yu-Chang Pai
- Applicant: Ying-Tso Lai , Yu-Chang Pai
- Applicant Address: TW New Taipei
- Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee: Hon Hai Precision Industry Co., Ltd.
- Current Assignee Address: TW New Taipei
- Agency: Altis Law Group, Inc.
- Priority: TW99124454A 20100723
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/09

Abstract:
A printed circuit board includes a layer. A layer of copper is covered on a surface of the layer. A through hole passes through the printed circuit board. An approximately C-shaped thermal engraving is defined in the surface of the layers, surrounding the through hole and without being covered by the layer of copper. An opening of the thermal engraving faces an output terminal of the power supply.
Public/Granted literature
- US20120018199A1 PRINTED CIRCUIT BOARD Public/Granted day:2012-01-26
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