Invention Grant
- Patent Title: Printed circuit board and method of manufacturing the same
- Patent Title (中): 印刷电路板及其制造方法
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Application No.: US12731173Application Date: 2010-03-25
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Publication No.: US08350159B2Publication Date: 2013-01-08
- Inventor: Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
- Applicant: Tetsuya Oosawa , Naoyuki Tanaka , Mitsuru Honjo
- Applicant Address: JP Osaka
- Assignee: Nitto Denko Corporation
- Current Assignee: Nitto Denko Corporation
- Current Assignee Address: JP Osaka
- Agency: Panitch Schwarze Belisario & Nadel LLP
- Priority: JP2009-077246 20090326
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H05K1/09 ; H05K1/03 ; H05K7/00 ; G11B21/16 ; G11B5/48

Abstract:
A base insulating layer is formed on a suspension body, and write wiring traces and read wiring traces are formed on the base insulating layer. The write wiring trace and the read wiring traces are formed on a body region of the base insulating layer, and the write wiring trace is formed on an auxiliary region of the base insulating layer. The base insulating layer is bent along a bend portion. This causes the write wiring trace to be positioned above the write wiring trace.
Public/Granted literature
- US20100243297A1 PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2010-09-30
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